ISL97635A
Absolute Maximum Ratings (T A = +25°C)
Thermal Information
VIN, FAULT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 24V
VDC, COMP, RSET . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 6.5V
Thermal Resistance (Typical, Notes 1, 2)
24 Ld QFN . . . . . . . . . . . . . . . . . . . . . .
θ JA (°C/W)
39
θ JC (°C/W)
2
SMBCLK, SMBDAT, FPWM, PWMO, EN/PWM . . . . . -0.3V to 6.5V
OVP, IIN0 - IIN5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 28V
LX. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 36V
PGND. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +0.3V
Above voltage ratings are all with respect to GND pin
Operating Conditions
Thermal Characterization (Typical, Note 3) PSI JT (°C/W)
24 Ld QFN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ~0.7
Maximum Continuous Junction Temperature . . . . . . . . . . . . +125°C
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C
Pb-free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . .see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +85°C
IMPORTANT NOTE: All parameters having Min/Max specifications are guaranteed. Typical values are for information purposes only. Unless otherwise noted, all tests
are at the specified temperature and are pulsed tests, therefore: T J = T C = T A
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTES:
1. θ JA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech
Brief TB379.
2. For θ JC , the “case temp” location is the center of the exposed metal pad on the package underside assumed under ideal case temperature.
3. PSI JT is the junction-to-top thermal resistance. If the package top temperature can be measured, with this rating then the die junction temperature
can be estimated more accurately than the θ JC and θ JC thermal resistance ratings.
4. Limits established by characterization and are not production tested.
Electrical Specifications
All specifications below are tested at T A = -40°C to +85°C; V IN = 12V, EN = 5V, R SET = 36.6k Ω , unless
otherwise noted. Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise
specified. Temperature limits established by characterization and are not production tested.
PARAMETER
DESCRIPTION
CONDITION
MIN TYP MAX UNIT
GENERAL
VIN
IVIN_STBY
V OUT
V UVLO
V UVLO_HYS
Backlight Supply Voltage
VIN Shutdown Current
Output Voltage
Undervoltage Lockout Threshold
Undervoltage Lockout Hysteresis
≤ 9 LEDs per channel (3.5V/30mA type)
6
2.45
300
24
5
34.5
2.8
V
μA
V
V
mV
REGULATOR
V DC
I VDC_STBY
I VDC
LDO Output Voltage
Standby Current
Active Current
VIN >6V
EN/PWM = 0V
EN/PWM = 5V
5.0
10
5.5
20
V
μA
mA
V LDO
SS
ENmin
VDC LDO Dropout Voltage
Soft-Start
Minimum Enable Signal
VIN > 5.5V, 30mA
30
1
40
200
mV
ms
μs
BOOST
SWILimit
Boost FET Current Limit
T A = +25°C
2.3
3.2
A
T A = -40°C to +85°C
2.2
A
r DS(ON)
Internal Boost Switch ON-Resistance
130
260
m Ω
4
FN6564.2
December 22, 2008
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